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Study Subject(s):Courses offered by the University
Course Level:Undergraduate
Scholarship Provider: Lingnan University
Scholarship can be taken at: Hong kong
Eligibility:-a degree, a sub-degree or a diploma awarded by a recognised post-secondary institution; -an International Baccalaureate Diploma;
-High School Diploma plus minimum of 1650 on SAT I;
-satisfactory completion of the first year in a four-year undergraduate curriculum or the first year of a sub-degree programme of a recognised post-secondary institution;
- satisfactory completion of two years of full-time study in a post-Form Five institution, e.g. a technical institute;
- other equivalent qualifications which the University will consider on a case-by-case basis. They may be required to achieve:
-a minimum of Grade C in English in the GCE O-Level or GCSE Examination or an equivalent public examination; or
- a TOEFL score of 213 in the computer-based test, or 550 in the paper-based test,or 79 in the internet-based test;or
- an IELTS overall band score of 5.5.
Scholarship Open for International Students: Yes
Scholarship Open for Students of Following Countries: All(except Hong Kong and the Chinese Mainland citizens)
Scholarship Description: Lingnan University offers scholarships to support outstanding non-local students to pursue full-time undergraduate studies at our University. Full Scholarship (covering tuition, hostel and other academic and living expenses), Tuition Scholarship or Half-tuition Scholarship per academic year will be awarded to successful applicants. Each Scholarship is offered on an annual renewable basis and is tenable for a period of up to 3 or 4 years (depending on the curriculum), subject to continued outstanding academic performance.The Scholarship will be awarded to a student who has good academic standing and a good track record in community services. For candidates of comparable academic merits, preference will be given to the candidate with better proven records of community services.
How to Apply: Online
Scholarship Application Deadline: March 31 , 2012